Embedded System Design Engineer

Job Purpose

We are seeking a talented and motivated System Engineer (AI Sub-system) to join our R&D team to support exploration and design of our next generation AI sub-system involving multi heterogeneous devices in high performance computing (HPC) SoCs.

Our division’s mission is to use the latest AI and cloud technologies to develop the best AI inference for advanced driver safety engineers building self-driving vehicles and other high performance compute products. Renesas is the leading automotive electronics supplier globally, and this is a rare opportunity to develop the infrastructure required to deploy our AI software to the billions of devices we ship to customers every year. You will join our newly formed AI & Cloud Engineering organization of around 100 software engineers. Due to strong demand for our AI-related products we are planning to triple in size in the next three years, so there is lots of room for you to help us grow the team together while remaining small. Our team’s key locations are Tokyo, London, Paris, Dusseldorf, Beijing, Singapore, Ho Chi Minh City, and other metropolitan areas, but you can also join fully remotely from other locations globally or get our support to relocate to our key hubs such as Tokyo.

Responsibilities

• Participate in the system solution design of next generation multi-core multi-chip AI sub-system that scales beyond 1000s TOPS for high performance computing.
• Perform system validation, use case validation, performance analysis, benchmarking, modeling to identify performance bottlenecks, and system parameters optimization.
• Deliver optimized solutions that meet the demanding requirements of HPC workloads and articulate them effectively across stakeholders ranging from toolchain, software and hardware teams, domain experts, and to technology leadership.
• Collaborate with hardware teams to design and optimize the system's computational components, including processors, accelerators, interconnects, and memory subsystems.
• Collaborate with software developers to define and implement software frameworks, libraries, and tools that maximize performance and productivity on the target HPC architecture.
• Collaborate with domain experts and application developers to understand the unique requirements of specific workloads and propose tailored architectural solutions.

Requirements

• Bachelor's or Master's degree in Computer Engineering, Electrical Engineering, or related field.
• 5 years of embedded system design and development of SoCs and/or ASICs.
• Good understanding of multiple key technology areas is expected (Camera/Image sensors, Graphics, Audio, Video, Display, AI/ML, Computer Vision, distributed systems, SoC architecture, RTOS).
• Good problem-solving abilities and the ability to analyze and address complex performance and scalability challenges.
• Programming skills in languages such as C, C++, and/or Python.
• Ability to translate and navigate business and customer needs into actionable items for software and hardware development teams.
• Working knowledge with ML frameworks like PyTorch and TensorFlow.
• Working knowledge of ARM and/or RISCV CPU.
• Working knowledge of software stack components, such as compilers, runtime systems, job schedulers, and scientific libraries.

Preferences

• Experience in performance optimization via software-hardware co-design is a plus.
• Experience with engineering tools and workflows for large systems is a plus.
• Experience with SystemC modeling is a plus.
• Working knowledge with ARM and/or RISCV ISA is a plus.
• Working knowledge with FPGA is a plus.
• Working knowledge with OpenCL/CUDA/SYCL programming is a plus.
• Working knowledge of system interconnects like GbE, PCIe, InfiniBand, etc is a plus.
• Working knowledge with RTL design is a plus.