1.Drive VM Yield, process improvement & packing quality improvement
2.Work collaboratively with equipment and manufacturing to improve productivity.
3.Work with supplier on daily packing related issue
4.Implement vision firewall and process improvement as part of Zero-Defect journey.
5.Lead TBE NPI and ensure timely execution.
6.Lead or need to update SOP, SWE,OCAP, FMEA, Control plan related to packing process
7.Support plantwide Visual Mechanical Containment & related CQC supports.
8.Support customer audits, ensure process compliance and proper documentation. In charge of Lot on hold, and support manufacturing on shipment/delivery for respected owned product.
9.Support Process implementation of new automation activity as part of productivity and Quality Improvement.
10.Lead productivity indices with implementing automation projects such as AGV, Smart Store and etc including supporting the qualification/validation of automated manufacturing system.
Requirement:
1.Educational background : Engineering Degree Minimum
2.Preferred working experience in semiconductor manufacturing and vision inspection.
3.Speedy, Multi-tasking, results-orientated and able to work in fast phase manufacturing environment.
4.Open-minded, willing to accept new challenges and overcome it with positive attitude.
5.Motivated team player with high level of ownership.
6.Able to communicate with all levels of people.
7.Knowledge/experience in programming language.
FR NXP Semiconductors France SAS
NXP is a semiconductor company specializing in secure connectivity solutions.
Updated
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