Job Responsibilities
- Support Pre-Assembly and IC end of line development activities: Multiples project.
- Support Engineering, data collection, data processing, transformation and draw conclusion for development and problem-solving purpose.
- Research on, Dicing defect reduction project, Package Design & Process variation impact.
Job Qualification
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The candidate must be pursuing a Bachelor in Material, Electrical or Mechanical engineering/science field.
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The candidate will be able attend the internship program more than 4 months
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Able to communicate with English, writing/reading, listening/speaking.
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Logical thinking and open mind.
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Eager to learn the new things.
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Programming / Data analytic / Power BI knowledge is advantage.
FR NXP Semiconductors France SAS
NXP is a semiconductor company specializing in secure connectivity solutions.
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