Principal / Senior Product Engineer - High Bandwidth Memory

 
SeniorPrincipal
🇸🇬 Singapore
Product Developer
Technology

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JR60629 Principal / Senior Product Engineer - High Bandwidth Memory

As a Principal/Senior engineer with HIG, HBM Product Engineering group at Micron Technology, Inc., you will support a new memory technology, High Bandwidth Memory (HBM), from New Product Introduction (NPI) to High Volume Manufacturing (HVM). We are seeking Principal/Senior engineer who will be the technical lead or individual contributor with experience in DRAM product/test development.

You will define and develop product engineering capabilities, and the corresponding PE debugging infrastructures and tools for problem solving. You will also collaborate with HBM engineering and manufacturing partners to develop test and process methodologies to support NPI and HVM works. You will perform test data analysis or electrical failure analysis on failures to improve yield, and test failure correlations, internal qualification and RMA. The candidate with previous experience working in memory component development, Fab Probe and Package/Stacking in a capacity of either product and test, design engineering will be advantageous.

This position will require excellent problem-solving and analytical skills, the ability to work well in teams and the ability to work well with others, good communication skills, self-motivation and keen to explore new innovations.

Key Responsibilities:

  • Support for HBM Product failure analysis from NPI to HVM stage
  • Perform manufacturing yield evaluation, data analysis and test correlation
  • Perform electrical failure analysis and characterization to resolve HBM related issues
  • Responsible for both product development and supporting high volume manufacturing of HBM
  • Characterize HBM to optimize product performance and maximizing product yield
  • Define and develop tests, test flow and methodologies for SLT/RMA/Qual coverage meeting qualification requirements

Requirements:

  • Bachelor/Master’s degree holder in Electrical/Electronic/Computer Engineering/Computer Science, with minimum 5 years of relevant experience
  • Relevant experience in DRAM or memory testing and failure analysis
  • Relevant experience with memory tester, knowledge of DDR4/5
  • Proficiency in programming languages such as C/C++/ Python
  • Knowledge of the Package Assembly flow and Package level Reliability
  • Knowledge of Wafer level testing, assembly steps/processes and package level testing

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_sg@micron.com

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

 

Micron Memory Taiwan Co.

Micron Memory Taiwan Co.

Micron Technology is a world leader in innovating memory and storage solutions.

Hardware
Technology
Manufacturing

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