SOC Package Substrate and Application Board Transmission Line Design Engineer

Hybrid
Mid-level
🇯🇵 Japan
Technology
 

Responsible for SoC package substrate and/or application PCB, circuit and artwork

  • Define the requirement of SoC package substrate and/or Reference Application PCB
  • Specify the outline of the circuit/artwork and define the verification method for it
  • Do circuit/artwork design and validate them with the specified method
  • Communicate engineers who design circuit and artwork
  • Write deltaied technical reports on development outputs

*The full details regarding your position scope as well as any future potential changes in work location and job scope will be provided during the interview process.

Requirements

  • Knowledge of PCB board circuit/artwork design for semiconductor system boards
  • Experience with simulation tools to perform signal quality evaluations
  • Knowledge of phenomena that affect signal quality, such as transmission loss, reflections, and crosstalk
  • Fundamental knowledge about memory devices and interfaces such as DDR, Flash, NVM is plus
  • Fundamental knowledge about standards of communication interfaces such as MIPI, PCIe, and else is plus
  • Fundamental knowledge in the electrical circuit of digital and analog

...

 

 

Renesas Electronics

Renesas Electronics

Renesas is a top global semiconductor company developing products for automotive, industrial, infrastructure, and IoT markets.

Automotive

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