Senior Engineer

• Perform failure analysis in finished or semi-finished failed product in drive, package or device level.
• Define FA flow for each FA case.
• Generate FA report and assist process engineer for root causing of defect/s.
• Maintain the FA dashboard and FA equipment in good condition.
• Develop the FA process and FA capability for new product and new technologies node.
• Innovate new FA methodology to improve TAT and FA accuracy.

Requirements

• Bachelor Degree and/or Master in Electrical/ Electronic, Microelectronic Engineering or Material Engineering with minimum 5 years in failure analysis.
• Familiar with SSD system, IC package and device analysis methodology.
• Familiar with semiconductor and SMT assembly process and technology.
• Familiar with memory product technology and structure.
• Understand memory product test process and methodology.
• Skillful in performing failure analysis with FA tools or methodology such as 3D X-ray, CSAM, SEM/EDX, chemical decapsulation, TDR, curve tracer analysis, optical microscopes, hot spot analysis.
• Strong memory IC de-processing skills.
• Good communication and presentation skills.
• Good teamwork spirit and growth mindset.
• Fluent in English speaking, reading and technical FA report writing.
• Previous electrical FA experience in IC or memory devices is preferred.