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Aptiv is a company that creates advanced safety systems, high-performance electrification solutions, and data connectivity solutions for automakers to bring advanced capabilities to more people around the globe, enabling sustainable mobility and helping to prevent accidents caused by human error
Updated
We are Aptiv - a global technology company with 190,000 specialists in 46 countries. We develop innovative software and build the hardware to bring autonomous driving cars, advanced driver-assistance systems, connected vehicles and smart cities to life in a way that only we can. We work in partnership with almost all car manufacturers. Our sensors, systems and software can already be found in almost all passenger cars today.
With our deep domain expertise, Aptiv is developing solutions that solve our customers' toughest challenges. We are enabling the transition to software-defined vehicles supported by electrified and intelligently connected architectures – which will combine to power the future of mobility.
Aptiv’s custom silicon management group provides critical custom Silicon for all Aptiv products including Autonomous Driving, ADAS, Infotainment, Zonal Control, and others. This team translates the system requirements of Aptiv’s next-generation products into the SOC/IC requirements and architectural design, then manages the technical performance of external SOC/IC design partners who design the custom silicon SOCs/ICs for use in Aptiv’s products.
Your Role
We are looking for an experienced package design engineer with excellent communication and supplier interfacing skills to complete packaging design projects/targets. This is an individual contributor role with high visibility and ideal person will lead packaging design related discussion with SOC design suppliers regularly. As part of Aptiv Custom Semiconductor management team, you will lead and drive packaging technology development of advanced SoC packaging architecture. The ideal candidate will take part in the development & implementation of new packaging technologies on APTIV SOC products to their qualification & validation from NPI to HVM. Take active part in SOC packaging related and in overall SOC development discussions on NPI, bring-up, improvement of Quality & reliability and Yield to meet performance of Aptiv products.
In this highly visible role, you will lead and drive SoC packaging development & qualification and set up future technologies roadmap to create differentiation for Aptiv SOC chip development and influence suppliers, foundry and OSATs partners roadmap. In your daily job you will:
Your Background
Key ingredients for succeeding in this role are your:
Preferred Qualifications
Why join us?
Your Benefits at Aptiv:
Apply today, and together let’s change tomorrow!
#LI-JK
Privacy Notice - Active Candidates: [https://www.aptiv.com/privacy-notice-active-candidates>
Aptiv is an equal employment opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, national origin, sex, gender identity, sexual orientation, disability status, protected veteran status or any other characteristic protected by law.
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