We are looking for a Sensor Packaging Development and Production Engineer to design and develop our IC packaging solutions. We are seeking an adaptable, well-organized engineer who can work between hardware, systems, IC and operations to drive our packaging development. The role is San Francisco based and will include some travel.
RESPONSIBILITIES:
- Design microelectronic assembly processes for automotive-grade receiver and transmitter packages / modules from wafer fab to package integration
- Define specifications for custom IC package designs and chip carriers to meet product and qualification requirements. Work with external partners to realize those parts
- Plan and execute process optimization and characterization, design validation, failure analysis, and sample builds for package development and automotive qualification
- Lead yield analysis and drive improvement/corrective actions for silicon process and microelectronic assembly
- Collaborate with external manufacturing partners to develop new packaging processes and prototypes to meet IC and system specifications.
- Manage vendors, including sourcing, vetting, quoting, design for manufacturing (DFM)...
![Ouster](https://lever-client-logos.s3.us-west-2.amazonaws.com/904b956c-6c33-441a-a6ed-f76112031236-1623876370532.png)
Ouster
Company that builds sensors and tools for engineers, roboticists, and researchers, with a focus on LIDAR technology
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