Sensor Package Development Engineer

We are looking for a Sensor Packaging Development and Production Engineer to design and develop our IC packaging solutions. We are seeking an adaptable, well-organized engineer who can work between hardware, systems, IC and operations to drive our packaging development. The role is San Francisco based and will include some travel.

RESPONSIBILITIES:

• Design microelectronic assembly processes for automotive-grade receiver and transmitter packages / modules from wafer fab to package integration
• Define specifications for custom IC package designs and chip carriers to meet product and qualification requirements. Work with external partners to realize those parts
• Plan and execute process optimization and characterization, design validation, failure analysis, and sample builds for package development and automotive qualification
• Lead yield analysis and drive improvement/corrective actions for silicon process and microelectronic assembly
• Collaborate with external manufacturing partners to develop new packaging processes and prototypes to meet IC and system specifications.
• Manage vendors, including sourcing, vetting, quoting, design for manufacturing (DFM)...