•Provide mechanical simulations and solutions for advanced 3D NAND products
•Predict and define structural risks and mechanisms using simulation tools for electronic packaging design, assembly and reliabilities
•Design and conduct fundamental level experiments for structural and material characterizations
•Work in Simulation calibration, validation and automation
•Research, explore and establish simulation capabilities in challenged areas
Requirements
•Master degree and above, PH.D is preferred. PH.D with 2-3 years working experience, and master should have 3-5 years working experience. (Working experience is not hard required for excellent candidates)
•Education background in mechanical/mechanics/material science, etc, and have a good understanding in solid mechanics, finite element method, material mechanical behaviors
•Should be familiar with semiconductor industry in package structure/materials/assembly/reliability.
•On-hand experience in mechanical simulations is preferred (Solidoworks/ANSYS/ABAQUS).
•At least be skillful in one programing language(python or others)
•Keen insight into the failure mechanism, be able to verify and improve the problems using simulation.
•Good team player, eager to learn and innovate.
Western Digital
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