You will be a part of the Automotive and Industrial Solutions Group which is a global leader in the design, manufacturing and marketing of Microcontrollers (MCUs) and Embedded Processors in the Automotive, Consumer and Industrial markets
You will be responsible for:
- Complete SoC flat Physical Verification sign-off like LVS, DRC, Yield enhancement (DFM), Antenna, ERC, PERC, ESD etc
- Understanding all DRM rules and ability to give early design feedback to ensure correct by construct design.
- Floorplanning at chip and block level.
- Package Closure : Padring creation for Flip chip and Wirebond Packages.
- Work closely with the block owners to achieve Physical Convergence through systematic fixes and minimal manual effort.
- Close interaction with worldwide team members apart from SOC team (IO/ESD/Systems/IP design teams/Package Team/validation)
Qualifications:
We are looking for a candidate with these specific personal characteristic and qualifications
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Master/Bachelor's Degree in Electrical/Electronic Engineering
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7-10 years of working experience in Physical Integration
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Must have a firm understanding and hands on experience into Physical verification at block and chip level DRC, LVS, DFM, Antenna, ERC, PERC, ESD etc
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Physical verification flow automation exposure will be an added advantage.
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Experience in PnR tools like ICC2/Innovus with regards to physical convergence
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Must possess a strong knowledge of Physical design flow
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Should be a team player and willing to work with cross functional teams in issues resolution
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Creative problem-solving skills and the ability to logically break complex problems down to manageable components
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Self-motivated and Good communication skill
DE NXP Semiconductors Germany GmbH
NXP is a semiconductor company providing advanced technology solutions for the automotive industry.
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