In this role, you will be engaged in all stages of a package design from architecture to feasibility studies to mass production. At the architecture stage, you will be working with cross functional teams to convey limitations and collect requirements. At the feasibility stage, you will be working on fast iterations of different design and interacting with stakeholders from silicon to system engineering. At the mass production, you will be both working with design services or will drive the production design and DFM with manufacturing partners.
This role is hybrid, based out of Toronto, Ontario, Taiwan, Austin, TX or Santa Clara, CA.
Responsibilities:
- Drive routing feasibility studies on organic substrate and 2.5D interposers
- Evaluate silicon floorplan and IP bump map proposals for different design-rule
- Work with cross functional team and collect input to define package ball-out
- Represent packaging team in cross functional meetings and articulate package technology limitations
- Design daisy chain packages for or test and qualification
- Work closely with Power and Signal Integrity engineers to come up with optimized solutions
- Work with external design services to c...
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